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Crump

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Fused filament fabrication

Crump

Fused filament fabrication is fused deposition modeling repackaged: same thermoplastic extrusion mechanism, same 1988 origin, same patent. RepRap renamed it to escape Stratasys’ trademark. Its real impact arrived only after the 2009 patent expiry enabled open hardware development. It delivers functional prototypes—not precision parts. It trades repeatability for accessibility.